Date:　2019/1/24 (Thu.) – 25 (Fri.)

venue: Kansai University
　　Centenary Memorial Hall
　　（3-3-35 Yamate-cho, Suita-shi, Osaka, Japan, 564-8680）

Welcome message

On behalf of the organizing committee, I cordially invite you to attend KUMP International Symposium, which will be from January 24 to 25, 2019, at Kansai University. “KUMP” (Kansai University Medical Polymer) is a group of medical polymers developed or under developing in Kansai University. In 2016, we started KU-SMART (Kansai University Smart Materials for Advanced and Reliable Therapeutics) Project, which is a collaborative research work by “Triple Ms”, Material Chemists (Department of Chemistry and Materials Engineering, KU), Mechanical Engineers (Department of Mechanical Engineering, KU) and Medical Doctors (Osaka Medical College), for the development of innovative medical devices based on KUMP. This project has been selected by the Ministry of Education, Culture, Sports, Science and Technology (MEXT) as Private University Research Branding Project, 2016-2020. (For details, please visit http://www.kansai-u.ac.jp/ku-smart/)
This Symposium aims to send our fruitful results and messages all over the world as an interim report of our project, and to accelerate our researches through discussion and collaboration with the excellent invited speakers from around the world.
It is a great pleasure for us to host KUMP International Symposium. All researchers (academic and industrial) and students interested in KUMP and our project are welcome to join this Symposium. We are very much looking forward to seeing all of you at Kansai University in Osaka.
　　　　　　

■ Important Dates

･ Conference Date：　January 24 (Thu.)  – 25 (Fri.), 2019

･ Registration：　Registration page now available. *Click Here to register for KUMP International Symposium.

Secretariat

Organization for Research and Development of Innovative Science and Technology, Kansai University

• Adress: 3-3-35 Yamate-cho, Suita-shi, Osaka, Japan, 564-8680
• TEL: +81(0)6-6368-1178
• FAX: +81(0)6-6368-0080
• E-mail: kump_intsymp@cm.kansai-u.ac.jp