{"id":659,"date":"2017-07-06T15:11:26","date_gmt":"2017-07-06T06:11:26","guid":{"rendered":"http:\/\/wps.itc.kansai-u.ac.jp\/colloid\/?page_id=659"},"modified":"2025-02-24T09:23:25","modified_gmt":"2025-02-24T00:23:25","slug":"sub02","status":"publish","type":"page","link":"https:\/\/wps.itc.kansai-u.ac.jp\/colloid\/english\/sub02","title":{"rendered":"2) Metal Based Inks for Printed \/Flexible Electronics"},"content":{"rendered":"

\"\"Most of the recent studies on conductive nanoinks have focused on silver nanoparticles because of their high conductivity and oxidation resistance. However, silver metals are too expensive to be used in large quantities. Furthermore, silver electrical circuits often suffer the problem of electro-migration. Therefore, Cu NPs are considered an alternative for conductive nanoinks because of their high conductivity, low cost, and reduced electro-migration effect. The major issue with Cu-based inks is easy oxidation in ambient air; the presence of copper oxide raises the sintering temperature and dramatically increases the electrical resistivity. To overcome these limitations, various types of copper-based inks have been developed to allow low-temperature (<150 \u00b0C) sintering for the preparation of conductive Cu films on flexible substrates: (i) reduction-assisted particle-based inks, (ii) nanoparticle-based inks with specific ligands, (iii) precursor-type inks (e.g., inks based on metal\u2212organic decomposition, MOD), and (iv) combination inks. Our group focuses on low-temperature sintering of Cu-based inks to produce conductive Cu films on flexible polymer\/paper substrates, ensuring the durability of sintered Cu films to safeguard their environmental stability and mechanical \ufb02exibility. These performances have become the most important task from a practical standpoint.<\/p>\n

\"\"\u3000\"\"<\/p>\n

\"\u9285\u30da\u30fc\u30b9\u30c8\/\u5927\u6c17\u4e0b\u30fb\u4f4e\u6e29\u713c\u6210\"\u3000\"\"<\/p>\n

<Copper based conductive inks>
\n\u30fbKawasaki et al. Chem. Commun<\/em>., 47, 7740 (2011)
\n\u30fbHokita et al. ACS Appl. Mater. Interfaces,<\/em> 7, 19382(2015)
\n\u30fbSugiyama et al. J. Mater. Sci.: Mater. Electron<\/em>., 27, 7540(2016)
\n\u30fbKawaguch\u3000et al. J. Coating Sci. Technol<\/em>., 3, 56(2016)
\n\u30fbKawaguch et al. Mater. Chem. Phys.<\/em>,197, 87(2017)
\n\u30fbAkiyama et al. Adv. Eng. Mater<\/em>. DOI: 10.1002\/adem.201700259. (2017)
\n\u30fbKanzaiki et al. ACS Appl. Mater. Interfaces<\/em>, 9, 20852 (2017)
\n\u30fbSakurai et al. Royal Society Open Science<\/em>, 5, 172417 (2018)
\n\u30fbSakurai et al. J. Mater. Sci. Mater. Electron, <\/em>30, 12130(2019)
\n\u30fbKuroda et al.\u00a0Colloid\u00a0 Interface\u00a0 Sci. Commun., <\/em>31, 100187(2019)
\n\u30fbTomotoshi et al.\u00a0Nanomaterials,<\/em> 10, 1689 (2020)
\n\u30fbTomotoshi et al. ACS Appl. Mater. Interfaces<\/em>, 13, 20906(2021)
\n\u30fb Sakaida et al. Mater. Lett.<\/em>136238(2024)
\n\u30fbIshikawa et al., ACS Appl. Electron. Mater.<\/em>, accepted (2025)<\/p>\n

<Electroless copper plating>
\n\u30fbNakasuji et al., Langmuir<\/em> 41, 729 (2025).<\/p>\n

<Silver based conductive inks>
\n\u30fbKeller et al. Mater. Lett.<\/em>, 284,128937(2021)
\n\u30fbSaita et al. Nanomaterials<\/em>, 12, 2004(2022)
\n\u30fbIkuto et al. J. Colloid. Interf. Sci.<\/em> 679, 900(2025)<\/p>\n

<Liquid metals>
\n\u30fbManyuan et al. J. Colloid Interface Sci.<\/em>649,581(2023)
\n\u30fbOtsuki et al. Mater. Chem. Phys.<\/em>314, 128844(2024)<\/p>\n","protected":false},"excerpt":{"rendered":"

Most of the recent studies on conductive nanoinks have focused on silver nanoparticles because of their high conductivity and oxidation resistance. However, silver metals are too expensive to be used Read More …<\/a><\/p>\n","protected":false},"author":61,"featured_media":0,"parent":14,"menu_order":0,"comment_status":"closed","ping_status":"closed","template":"","meta":{"_monsterinsights_skip_tracking":false,"_monsterinsights_sitenote_active":false,"_monsterinsights_sitenote_note":"","_monsterinsights_sitenote_category":0,"footnotes":""},"class_list":["post-659","page","type-page","status-publish","hentry"],"_links":{"self":[{"href":"https:\/\/wps.itc.kansai-u.ac.jp\/colloid\/wp-json\/wp\/v2\/pages\/659","targetHints":{"allow":["GET"]}}],"collection":[{"href":"https:\/\/wps.itc.kansai-u.ac.jp\/colloid\/wp-json\/wp\/v2\/pages"}],"about":[{"href":"https:\/\/wps.itc.kansai-u.ac.jp\/colloid\/wp-json\/wp\/v2\/types\/page"}],"author":[{"embeddable":true,"href":"https:\/\/wps.itc.kansai-u.ac.jp\/colloid\/wp-json\/wp\/v2\/users\/61"}],"replies":[{"embeddable":true,"href":"https:\/\/wps.itc.kansai-u.ac.jp\/colloid\/wp-json\/wp\/v2\/comments?post=659"}],"version-history":[{"count":26,"href":"https:\/\/wps.itc.kansai-u.ac.jp\/colloid\/wp-json\/wp\/v2\/pages\/659\/revisions"}],"predecessor-version":[{"id":3338,"href":"https:\/\/wps.itc.kansai-u.ac.jp\/colloid\/wp-json\/wp\/v2\/pages\/659\/revisions\/3338"}],"up":[{"embeddable":true,"href":"https:\/\/wps.itc.kansai-u.ac.jp\/colloid\/wp-json\/wp\/v2\/pages\/14"}],"wp:attachment":[{"href":"https:\/\/wps.itc.kansai-u.ac.jp\/colloid\/wp-json\/wp\/v2\/media?parent=659"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}